Advanced diffusion technique ensuring the homogeneity of energy conversion efficiency of the cell.

Advanced PECVD film forming, providing a dark blue silicon nitride anti-reflection film of homogenous color and attractive appearance.

High quality metal paste for back surface and electrode, ensuring good conductivity, high pulling strength and ease of soldering.

Excellent anti-PID performance to ensure the stability of the module power.

Rigorous standards and finger design, effectively reducing the power loss.

High precision patterning using screen printing, ensuring accurate busbar location for ease with automatic soldering a laser cutting.